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超微 C741 X13DAI-T

超微 C741 X13DAI-T

Product SKUsMBD-X13DAI-TPhysical StatsForm FactorEATXDimension12.1" x 13.1" (30.734cm x 33.274cm)ProcessorCPU5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processorsDual Socket Socket

  • 参数： 5th/4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP

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Product SKUs
MBD-X13DAI-T
Physical Stats
Form Factor

  • EATX

Dimension

  • 12.1" x 13.1" (30.734cm x 33.274cm)

Processor
CPU
Core

  • Up to 64 cores

System Memory
Memory Capacity

  • 16 DIMM slots

  • Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s

Memory Type

  • 5600/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) 256GB 5600MT/s

DIMM Sizes

  • 16GB, 32GB, 64GB, 96GB, 128GB, 256GB

  • RDIMM: Up to 256GB

Memory Voltage

  • 1.1V

Error Detection

  • Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset
SATA

  • 8 SATA3 ports; RAID 0, 1, 5, 10

  • 2 SATA3 ports; RAID 0,1

Network Controllers

  • Dual LAN with Broadcom BCM57416 10GBase-T

Input / Output
USB

  • 6 USB 3 port(s) (2 headers; 4 rear type A)

  • 2 USB 2 port(s) (2 headers)

  • 1 USB 3.1 Gen2 port(s) (1 headers)

Video Output

  • 1 VGA D-Sub Connector port(s)

Serial Port

  • 2 COM Port(s) (1 header; 1 rear)

TPM

  • 1 TPM Header

Expansion Slots
PCIe

  • 1 PCIe 5.0 x8,

  • 5 PCIe 5.0 x16

M.2

  • M.2 Interface: 2 PCIe 5.0 x4

  • Form Factor: 2280/22110

  • Key: M-Key

System BIOS
BIOS Type

  • AMI 32MB AMI UEFI

BIOS Features

  • ACPI 6.4

  • SMBIOS 2.8/3.5

  • UEFI 2.8A

  • Plug and Play (PnP)

  • PCI FW 3.2

Management
Software
PC Health Monitoring
FAN

  • 13x 4-pin fan headers (up to 13 fans)

Operating Environment
Operating Temperature Range

  • 10°C - 35°C (50°F - 95°F)

Non-Operating Temperature Range

  • -40°C - 70°C (-40°F - 158°F)

Operating Relative Humidity Range

  • 8% - 90% (non-condensing)

Non Operating Relative Humidity Range

  • 5% - 95% (non-condensing)



  1. Support CXL

  2. 5th/4th Gen INTEL® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP

  3. INTEL® C741 Chipset

  4. Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots

  5. Broadcom BCM57416 Dual ports 10G LAN

  6. 2 SATA DOM ports

  7. 2 M.2

  8. 4 NVMe ports PCIe 5.0 x4 via 2 MCIO connectors

  9. 5 PCIe 5.0 x16

  10. 1 PCIe 5.0 x8

  11. 8 SATA 3.0 ports(C741, RAID 0, 1, 5, 10)

  12. HD Audio 7.1 channel

  13. 1 USB 3.1 Gen 2, 6 USB 3.0


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